师资队伍

集成电路学院

庄昕明

邮箱:xmzhuang@sdu.edu.cn

研究领域:感-存-算一体突触晶体管、低功耗源栅晶体管及其传感器、低温溶液工艺制备高可靠性柔性薄膜晶体管

个人简介

庄昕明,山东大学集成电路学院研究员,齐鲁青年学者,山东省高层次人才。本硕博毕业于电子科技大学电子薄膜与集成器件国家重点实验室,2018年10月至2020年9月在美国西北大学Tobin J. Mark和Antonio Facchetti课题组进行交流访问,2021年1月至2023年4月在山东大学从事博士后研究工作,迄今为止在PNAS, J. Am. Chem. Soc., Nat. Mater., Adv. Mater., Nano Lett., Adv. Sci., Adv. Funct. Mater., Chem. Mater., 等期刊发表论文40余篇。授权发明专利10项。

研究领域

感-存-算一体突触晶体管、低功耗源栅晶体管及其传感器、低温溶液工艺制备高可靠性柔性薄膜晶体管

代表性成果

【1】Xinming Zhuang#, Joon-Seok Kim#, Wei Huang*, Yao Chen, Gang Wang, Jianhua Chen, Yao Yao, Zhi Wang*, Fengjing Liu, Junsheng Yu, Yuhua Cheng, Zaixing Yang*, Lincoln J. Lauhon*, Tobin J. Marks*, and Antonio Facchetti*, High Performance and Low Power Source-Gated Transistors Enabled by a Solution-Processed Metal Oxide Homojunction, Proceedings of the National Academy of Sciences USA, 2023, 120, e2216672120.

【2】Xinming Zhuang, Sawankumar Patel, Chi Zhang, Binghao Wang, Yao Chen, Haoyu Liu, Vinayak P. Dravid, Junsheng Yu*, Yan-Yan Hu*, Wei Huang*, Antonio Facchetti*, and Tobin J. Marks*, Frequency-Agile Low-temperature Solution-Processed Alumina Dielectrics for Inorganic and Organic Electronics Enhanced by Fluoride Doping, Journal of the American Chemical Society, 2020, 142, 12440-12452.

【3】Xinming Zhuang#, Zixu Sa#, Jie Zhang, Mingxu Wang, Mingsheng Xu, Fengjing Liu, Kepeng Song, Tao He, Feng Chen, and Zai-xing Yang*, An Amorphous Native Oxide Shell for High Bias-Stress Stability Nanowire Synaptic Transistor, Advanced Science, 2023, 2302516.

【4】Mingxu Wang, Xinming Zhuang*, Fengjing Liu, Yang Chen, Zixu Sa, Yanxue Yin, Zengtao Lv, Haoming Wei, Kepeng Song*, Bingqiang Cao, and Zai-xing Yang*, New Approach to Low-Power-Consumption, High-Performance Photodetectors Enabled by Nanowire Source-Gated Transistors, Nano Letters, 2022, 22, 9707–9713.

【5】Zhi Wang#,*, Xinming Zhuang#, Binghao Wang, Wei Huang*, Tobin J. Marks*, and Antonio Facchetti*, Doping Indium Oxide Films with Amino-Polymers of Varying Nitrogen Content Markedly Affects Charge Transport and Mechanical Flexibility, Advanced Functional Materials, 2021, 31, 2100451.

联系方式

电子邮箱:xmzhuang@sdu.edu.cn